Wednesday 28 October 2015

Qualcomm's Snapdragon 820 Still Overheats, but Samsung May Help Fix the Issue - Report




There are many handset makers that have put their trust in Qualcomm recently, as the chipset manufacturer announced several weeks ago that more than a dozen devices packing its most powerful SoC (system-on-chip), the Snapdragon 820, would be released in the first half of 2016.

After the overheating issues that affected the Snapdragon 810 chipset, many companies decided to go with Qualcomm's hexa-core Snapdragon 808 processor instead.

Even though Qualcomm denied the issue numerous times and said that it already fixed the overheating issues that many smartphone users had been complaining about, it appears that the same problem is affecting the chipset the company plans to launch next year.

SamMobile reports sources familiar with Qualcomm's business have told Korean media that the Snapdragon 820 chipset has similar overheating issues.

The Snapdragon 810 “heatgate” is happening again?

However, the chipset maker has allowed Samsung's engineers to help address this problem by the time Snapdragon 820 gets inside the most powerful and expensive smartphones soon to be available on the market.

Since Samsung has decided to lend its expertise in order to fix the overheating issues affecting the Snapdragon 820, it's certain that the South Korean company plans to use this particular chipset inside its Galaxy S7 smartphone that's supposed to be unveiled early next year.

One other reason Samsung is desperately trying to stabilize the Snapdragon 820 CPU is the fact that it's manufactured using its own 14nm FinFET process.

If Samsung is successful in addressing these issues, then the Galaxy S7 sales will be boosted since it packs one of the most powerful chipsets on the market. If not, the Galaxy S7 won't be doomed since Samsung plans to launch three variants with different chipsets.

Unfortunately, there's no telling whether or not these reports are accurate, or someone wants to sink Qualcomm's shares even more.

Source : softpedia.com

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